Warpage Less Than 0.76mm Black Electronic Components IC Chips Trays For Consistent Performance
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Warpage Less Than 0.76mm Black Electronic Components IC Chips For Consistent Performance Stackable, durable, and dimensionally accurate—our JEDEC trays are the packaging products trusted by global IC manufacturers. Developed to cater to the needs of precision-driven electronic manufacturing, this JEDEC matrix tray is designed to provide secure, static-safe handling of components during both automated and manual workflows. The tray......
Shenzhen Hiner Technology Co., Ltd.
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